JPH0222992Y2 - - Google Patents
Info
- Publication number
- JPH0222992Y2 JPH0222992Y2 JP1984145321U JP14532184U JPH0222992Y2 JP H0222992 Y2 JPH0222992 Y2 JP H0222992Y2 JP 1984145321 U JP1984145321 U JP 1984145321U JP 14532184 U JP14532184 U JP 14532184U JP H0222992 Y2 JPH0222992 Y2 JP H0222992Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- circuit board
- gold
- watch
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984145321U JPH0222992Y2 (en]) | 1984-09-26 | 1984-09-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984145321U JPH0222992Y2 (en]) | 1984-09-26 | 1984-09-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6163839U JPS6163839U (en]) | 1986-04-30 |
JPH0222992Y2 true JPH0222992Y2 (en]) | 1990-06-21 |
Family
ID=30703576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984145321U Expired JPH0222992Y2 (en]) | 1984-09-26 | 1984-09-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0222992Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5716740A (en) * | 1980-07-04 | 1982-01-28 | Hitachi Ltd | Protective unit for blower of air conditioner or the like |
-
1984
- 1984-09-26 JP JP1984145321U patent/JPH0222992Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6163839U (en]) | 1986-04-30 |
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